The Inspectis Light BGA hand operated inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis o…
The Inspectis Light BGA hand operated inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis of hidden solder joints of BGA, µBGA, CSP, CGA, FipChip, and top view SMD components. The powerful optics make it possible to obtain images of hidden solder joints down to 40 microns stand off. This system is equipped with Inspectis BGA Basics software featuring tools for image capture, distance measurement, utility, and analysis. View the Inspectis BGA Inspection System ProX.
Side-view BGA Lens:
Magnification: ~ 25x - 200x on 24" monitor (on-screen magnification)
Working Distance: ~ 0.5 - 25mm (focusing range)
Illumination: High power built in pure white LED light source through microprisms.
Footprint of standard size probe: 0.85 x 6.6mm on PCB (~ 1mm free area around IC package is required)
Integrated digital camera:
Sensor: 1/2.5" CMOS
Pixel Size / Resolution: 2.2µm x 2.2µm / 2592(H) x 1944(V) pixels.
Interface: USB3.0/USB3.1 Gen 1 (backwards compatible with USB2.0
The Inspectis Light BGA hand operated inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis of hidden solder joints of BGA, µBGA, CSP, CGA, FipChip, and top view SMD components. The powerful optics make it possible to obtain images of hidden solder joints down to 40 microns stand off. This system is equipped with Inspectis BGA Basics software featuring tools for image capture, distance measurement, utility, and analysis. View the Inspectis BGA Inspection System ProX.
Side-view BGA Lens:
Magnification: ~ 25x - 200x on 24" monitor (on-screen magnification)
Working Distance: ~ 0.5 - 25mm (focusing range)
Illumination: High power built in pure white LED light source through microprisms.
Footprint of standard size probe: 0.85 x 6.6mm on PCB (~ 1mm free area around IC package is required)
Integrated digital camera:
Sensor: 1/2.5" CMOS
Pixel Size / Resolution: 2.2µm x 2.2µm / 2592(H) x 1944(V) pixels.
Interface: USB3.0/USB3.1 Gen 1 (backwards compatible with USB2.0
This side-view optical BGA inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis of hidden solder joints of BGA, µBGA, CSP,...
This side-view optical BGA inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis of hidden solder joints of BGA, µBGA, CSP,...
This flight case features a rigid frame and sturdy locking system along with specially designed foam for the safe transport of a complete BGA Inspection System and accessories.
NOTE: This item is...
The Inspectis Stent Inspection System includes the Inspectis U30 UHD-4K digital inspection microscope with 30:1 motorized zoom, a slider stand with up to 60º view angle, white LED ring light, and...
This Inspectis BGA fiber microprism background illumination unit with LED light source provides dimmable incident illumination for optimal images.
Manufactured in Sweden. Inspectis provides a...