Inspectis BGA Inspection System ProX

This side-view optical BGA inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis of hidden solder joints of BGA, µBGA, CSP, CGA, FipChip, and top view SMD components. The background fiberoptics light allows for imaging of the first row up to 20 rows of BGA solder bumps. The powerful optics make it possible to obtain images of hidden solder joints down to 40 microns stand off. This system is equipped with Inspectis BGA ProX software which inlcudes all the tools of Inspectis Basics software with the addition of enhanced tools for overlays on live images, comparison, focus stacking, reporting and annotations. View the Inspectis BGA Inspection System Basics.

Contact Microscope World for a quote including shipping. 

• Side-view BGA Lens: 
  • Magnification: ~ 25x - 200x on 24" monitor (on-screen magnification)
  • Working Distance: ~ 0.5 - 25mm (focusing range)
  • Illumination: High power built in pure white LED light source through microprisms.
  • Footprint of standard size probe: 0.85 x 6.6mm on PCB (~ 1mm free area around IC package is required)
• Top View 8-80x Lens: 
  • Magnification: ~ 8x - 80x on 24" monitor (on-screen magnification)
  • Working Distance: ~10 - 150mm
  • Illumination: Built in pure white LED ring light with holographic diffuser
  • Size: 29(D) x 36(L)mm (1.14 x 1.42 inches)
    
• Integrated digital camera:
  • Sensor: 1/2.5" CMOS
    
  • Pixel Size / Resolution: 2.2µm x 2.2µm / 2592(H) x 1944(V) pixels.
  • Interface: USB3.0/USB3.1 Gen 1 (backwards compatible with USB2.0
  • Video Formats: 2592×1944 (5 MP) @15fps, 2000×1500 (3MP)@24fps, 1920×1080 (Full HD)@30fps
  • Controls: Auto/manual white balance, auto/manual exposure, contrast, brightness, frame stacking, gamma, sharpness, high dynamic range, horizontal and vertical flip.
  • Preset/Recall Memories: Two factory set and two user definable with quick access buttons.
  • Preset/Recall calibration magnifications: Five factory set and ten user definable calibrated magnifications with quick access buttons.
  • Image Capture: Snap with switch on device, optional foot-pedal or by software.
  • Software: INSPECTIS©BGA ProX with direct digital camera controls and featurestools for image capture, advance camera controls, measurements, live image view, image comparison and documentation.
  • Video Capture format: JPG, PNG, AVI
  • Mount: UNC 1/4"-20
    
• Illumination: Incident LED light, Micro prism background light LED, LED gooseneck brush light. Electronic light intensity control.
  
• Stand: Large antistatic coated base stand with coarse and fine focus axial rack and pinon, +/-90º pivoting function with soft touch probe protection mechanism.
• Stage:  Precision XY stage with 50x50mm travel range and micrometer drive. Antistatic protection.
• Environmental Protection: ESD protected with GND connection points on stand bracket and XY-stage.
  
• Size / Weight: 470(L) 350(W)x 385(H) mm (18.5 x 13.78 x 15.15 inches) / 14 kgs (30.9 lbs)
• Storage / Operating Environment: -20º - +60ºC / -5ºC - +40ºC, 20-95% RH, non-condensing
• Manufactured in Sweden.

View the Inspectis BGA Inspection System brochure here.

NOTE: This item is not returnable.